Influence of Thermal Fluctuation on Bonding Accuracy in Die-Attach Proces

Effect of Die Bonding Condition for Die Attach Film Performance in 3D QFN Stacked Die

Consumer demand for smaller and lighter products in wiresless application with maximum functionality had drive the semiconductor industries toward the developement of 3-dimensional stacked die. One of the key technology is relies on die stacking process. A suitable bonding condition and material set are essential to achieve required reliability performance. This study is to relate the effects o...

Bonding Semiconductor Laser Chips: Substrate Material Figure of Merit and Die Attach Layer Influence

The coefficient of thermal expansion (CTE) and the thermal conductivity are the two key parameters to consider when selecting a particular substrate material for a die bonding process. We will discuss here a model to determine the substrate material giving the best chip reliability expectations for GaAs and InP laser chips. In that respect, a comparison of the thermo-mechanical stresses induced...

Thermal Characterization of Die-Attach Degradation in the Power MOSFET

Effect of Thermal Properties of Die Attach Materials on Performance of High Power Blue Leds

InGaN-based High Power blue LEDs exhibit a maximum light conversion efficiency of 40%, which decreases further at high drive currents. Thus, more than 60% of the electrical input power is dissipated as heat in an LED chip, leading to a rise in the junction temperature of the LED. Junction temperature has a significant impact on the light conversion efficiency of the LEDs. Also, it reduces LED l...

A Breakthrough in Power Electronics Reliability – New Die Attach and Wire Bonding Materials

Power Electronics on DCB are used for high power devices. There is a wide field of applications for such power electronic devices like converters or inverters for wind mills, solar parks or for electric and hybrid vehicles. High efficiency, long life time and increased power density are the major technical requirements for those devices. Especially the life time, but also the power density are ...